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| Custom Modules |
| Commercial/Moisture Resistant/Hermetic |
| Customizing an electronic package to meet specific customer requirements involves the precise selection of many components. High power IGBTs, MOSFETs, SCR, Diodes and Darlington Transistors, along with driver circuits, isolated materials, packages and terminals, are the key elements in custom package design. Powerex has continuing access to the most advanced circuit and chip design.
For more information on our Custom Modules see the technical library resources for Custom Modules |
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Customers Looking for Application Specific Custom Power Modules Benefit From Powerex’s Years of Experience In:
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- Chip Manufacturing
- Design/Engineering
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Substrates:
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- Aluminum Nitride
- Alumina
- IMS
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Packages:
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- Standard IGBT Cases
- Picture Frame
- Custom Package Development For Both Plastic And Hermetic Packages
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Die Technology:
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- IGBT
- MOSFET
- Bipolar
- SCR
- HVIGBT
- FR Diode
- Diode
- GTO
- S, C Diode
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Voltage: 30V to 4500V
Current: 50A to 1500A
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| Selector Grids
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Custom IGBT Modules
Custom Fast Recovery & Three-Phase Diode Modules
Custom MOSFET Modules
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 Create your own Custom Module |
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