| Featured Document |
Date: February 2008
Subject: Powerex Introduces Standard Package IGBT's Featuring Lowest Thermal Resistance
FOR IMMEDIATE RELEASE
Description: Powerex recently introduced a new wide range of IGBT modules, NX-Series, developed with a new package design that uses a building block concept to provide multiple configuration options, improved manufacturability, reduced development time and lower cost.
NX-Series features high thermal conductivity Aluminum Nitride (AlN) ceramic to provide improved heat transfer from the power chips to the heatsink. The result is lower chip temperature (Tj) and more than ten-fold improvement in thermal cycle life. (For more details on this feature, contact the Powerex Applications Support Team at 724-925-7272 Option 3.)
Product Ratings and Characteristics Description
A common base plate and case shell are used with interchangeable screw terminal box and pin terminals to create single, dual, seven-pack and converter-inverter-brake circuit configurations ranging from 75 to 600A at 600V and 35 to 600A at 1200V with NTC thermistor output in a 17mm thin package.
This new series also uses an exclusive fifth generation Carrier Stored Trench Gate Bipolar Transistor (CSTBT) chip technology and RoHS compatible lead free solder. The CSTBT structure provides reduced switching and conduction losses compared to conventional IGBTs.
The highest power cycling capability is achieved using AlN ceramic, high elastic Sn-Ag-Cu solder and a proprietary technique to ensure uniform solder thickness.
Applications Description
NX-Series IGBTs were designed for general purpose motor drives. Dual and single types are also applicable to power quality and alternate energy applications
Contact Info Description
For pricing and availability, call Powerex at 1-800-451-1415 to locate your local sales office.
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