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Applications
  • PV inverters
  • UPS
  • High speed motor drives
  • Induction heating
  • Welding
  • Military & Aerospace power converters
  • Medical imaging amplifiers
  • Electric vehicle
  • Boost converters
Product Advantages
  • Significant reduction in switching losses
  • Increased system efficiency
  • High temperature operation
  • Higher operating frequency
  • Reduced cooling requirements
  • Zero reverse recovery current from diode
  • Low parasitic inductance
  • Reduced system size / high power density
Full SiC & Hybrid SiC IGBTs
PDF
Overview
Large bandgap energy and high field breakdown are two primary characteristics of silicon carbide (SiC) which have been leveraged to create a new generation of power semiconductors with zero reverse recovery charge, significantly lower switching losses and the opportunity for higher temperature operation.

Powerex packages SiC MOSFETs and Schottky barrier diodes from leading suppliers into high performance all SiC modules or with high frequency silicon IGBTs into hybrid Si / SiC modules. The new low profile split dual package features low inductance and either a copper or AlSiC baseplate for high thermal cycling applications.

Package Configuration
Product Package Dimensions
Product Line-up
Split Dual Hybrid Si/SiC
QID1210005, Cu Baseplate Split Dual, 1200V, 100A
QID1210006, AlSiC Baseplate Split Dual, 1200V, 100A

All SiC
QJD1210010, Cu Baseplate Split Dual MOSFET, 1200V, 100A
QJD1210011, AlSiC Baseplate Split MOSFET, 1200V, 100A
QRD1210004, CU Baseplate Split Dual Superfast SiC Diode, 1200V, 100A
QRD1210005, AlSiC Baseplate Split Dual Superfast SiC Diode, 1200V, 100A
Features
QID1210005, QID1210006
  • Low ESW(off)
  • Aluminum Nitride Isolation
  • Discrete Super-Fast Recovery Free-Wheel Silicon Carbide Schottky Diode
  • Low Internal Inductance
  • 2 Individual Switches per Module
  • Isolated Baseplate for Easy Heat Sinking
  • Automated Assembly Assures High Reliability
  • NFH Silicon IGBTs

QRD1210004, QRD1210005
  • Low ESW(off)
  • Aluminum Nitride Isolation
  • Discrete Super-Fast Recovery Free-Wheel Silicon Carbide Schottky Diode
  • Low Internal Inductance

QJD1210010, QJD1210011
  • Junction Temperature: 175°C
  • Silicon Carbide Chips
  • Low Internal Inductance
  • Discrete Super-Fast Recovery Free-Wheel Silicon Carbide Schottky Diode
  • High Speed Switching
  • Low Switching Losses
  • Low Capacitance
  • High Power Density
  • Isolated Baseplate
  • Aluminum Nitride Isolation
  • 2 Individual Switches per Module

For more information:
email: globalsales@pwrx.com
phone: 724-935-7272, Option 3 (Applications Engineering Assistance)
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